★Microcomputer bottom dead point detection device
Model description:
SD-401: equipped with a host and a single-point output device.
SD-402: equipped with a host and two dual-point output devices.
★ Comprehensive and detailed analysis and application
1. Model details:
The SD-401 microcomputer bottom dead point detection device is designed to meet basic and precise industrial detection needs. It is carefully equipped with a high-performance host and a single-point output device to ensure that the position information of the bottom dead point can be accurately captured and fed back during a single stamping process, providing a solid guarantee for the stable operation of the production line. The SD-402 model has been functionally upgraded on the basis of the SD-401. It not only has an efficient host, but also has two dual-point output devices. This configuration enables it to provide more comprehensive and detailed detection data when handling complex stamping tasks, effectively improving production efficiency and product quality.
2. In-depth analysis of product features:
- Refinement of sensor adjustment steps: To ensure detection accuracy, users need to first carefully adjust the distance between the upper iron block and the sensor head, and accurately control it within a narrow range of 0.8mm to 1.2mm. This step is crucial because it directly affects the accuracy of subsequent detection. Subsequently, by pressing the setting switch, the screen will start a digital display process from 199 to 0. During this period, the user needs to fine-tune the position of the sensor head so that the operating distance forms a one-to-one correspondence with the number displayed on the screen (80 to 120), that is, 0.8mm to 1.2mm of the actual distance. After completing this fine adjustment, press the setting button again, and the system will return to its initial state and prepare to enter the formal detection stage.
- Flexibility of monitoring value setting: Considering the different requirements for detection accuracy in different application scenarios, this device provides a wide precision setting range of ±1um to ±99um. Users can flexibly select appropriate monitoring values for setting according to actual production needs, so as to maximize detection accuracy and reliability while ensuring production efficiency.
- Intelligent mold height test function: At the critical stage before the die starts to operate, the device automatically performs four precision tests and quickly calculates and displays the average value of the mold height. This function not only helps to detect problems such as mold wear or improper installation in a timely manner, but also provides accurate reference data for subsequent stamping operations. It is worth noting that the average value will only be recalculated when the punch power switch is turned off or the induction line is reconnected to the sensor, thus ensuring the continuity and accuracy of the data.
- Immediacy of abnormal indication: In order to ensure the safe and stable operation of the production line, the device is also equipped with an advanced abnormal indication system. When abnormal conditions such as abnormal speed, equipment shutdown, or sudden detachment of the upper and lower mirror blocks are detected, the device will immediately issue a striking indication signal to remind the operator to take timely measures to deal with it. This function not only effectively reduces the risk of production accidents, but also improves the overall stability and reliability of the production line.
- OP status: OP status stands for "Open Circuit" or "Out of Position", that is, open circuit or position abnormality status. When the sensing line of the microcomputer bottom dead point detection device is broken due to aging, wear or unexpected circumstances, or the sensing probe is pulled apart or displaced due to external force, resulting in the transmission signal, the system will automatically enter the OP state. At this time, the device will immediately sound an alarm to remind the operator to check and repair the fault to prevent production interruption or safety accidents caused by detection failure.
- HI state: HI state refers to "High Limit" or "High Deviation", that is, exceeding the upper limit or high deviation state. During the operation of the microcomputer bottom dead point detection device, the system will continuously monitor the distance between the detected object and the preset reference point. When this distance exceeds the preset safety threshold, such as 1.2mm, the system will automatically determine it as an abnormal situation and immediately trigger the HI state. At this time, the abnormal red light on the device will light up, and the high-level yellow indicator light will also flash, warning the operator in a striking way that there is a risk of over-distance or excessive deviation, and immediate measures need to be taken for adjustment or maintenance.
- LO state: Corresponding to the HI state, the LO state represents "Low Limit" or "Low Deviation", that is, below the lower limit or low deviation state. Similarly, during the detection process, if the system finds that the distance between the detected object and the reference point is lower than the set safety lower limit, such as 0.8mm, the LO state will be triggered. At this time, the abnormal red light and the low red indicator light will light up at the same time, giving an emergency warning to the operator, indicating that there is a risk of being too close or touching, and immediate measures need to be taken to avoid potential collision or damage.
- ES state: ES state is the abbreviation of "Error Signal" or "Exception State", that is, error signal or abnormal state. In the application scenario of the microcomputer bottom dead point detection device, the ES state may be triggered by a variety of abnormal conditions, including but not limited to misdelivery detection (that is, the material is not delivered at the expected position or time), material missing detection (such as holes or material shortages on the production line), extrusion detection (excessive material accumulation causes equipment blockage), etc. Once the system detects these abnormal conditions, the ES state will be activated, and an audible and visual alarm will be issued to remind the operator to respond quickly, find out the cause and take effective measures to solve the problem to ensure the continuous and stable operation of the production line.
- When the tolerance value display exceeds the set value, the abnormal light will light up. The microcomputer bottom dead point monitor is an intelligent device that integrates advanced technology and precision design. It is designed for key control points in mold manufacturing and industrial production processes. One of its core features is its highly sensitive and accurate tolerance detection capability. When the actual tolerance value detected by the monitor exceeds the safety range pre-set by the user, the system will immediately trigger the abnormal indicator light to remind the operator in a striking way to pay attention to the current abnormal situation, so as to quickly take necessary adjustment measures to effectively avoid production accidents and ensure the stable operation of the production line.
- The monitor also has a powerful built-in self-detection capability. This feature enables it to automatically conduct a comprehensive inspection of its own operating status without relying on external equipment, including sensor sensitivity, stability of the data processing unit, and reliability of the communication interface. Through regular self-detection, potential failure risks can be discovered and warned in a timely manner, greatly improving the reliability and maintenance convenience of the equipment.
- The specification setting value of this machine is 1um unit, which can be selected according to the mold accuracy requirements. In terms of specification setting, the microcomputer bottom dead point monitor provides a fine adjustment function in units of 1 micron, which means that users can flexibly adjust the threshold of the monitor according to the specific accuracy requirements of the mold to ensure the accuracy and applicability of the monitoring results. This high degree of flexibility enables the monitor to be widely used in various precision manufacturing fields, meeting the high standards of different customers for product quality and production efficiency.
- This detector can be equipped with misfeed detection, material absence detection (electric eye detection), and extrusion detection (sensing rod detection). In addition to the basic bottom dead point monitoring function, the microcomputer bottom dead point monitor also provides a wealth of expandable functions to further improve its comprehensive performance. These include wrong feeding monitoring (misfeed detection), which uses high-precision sensors to monitor abnormal conditions in the feeding process in real time, such as unstable feeding speed, feeding position deviation, etc., to ensure that the raw materials can be accurately delivered to the designated location; material missing monitoring (electric eye detection), using advanced photoelectric detection technology to monitor the presence of materials on the production line in real time. Once material missing is found, an alarm is immediately issued to avoid production interruption; and extrusion status monitoring (sensing rod detection), through the sensing rod to accurately measure the extrusion pressure in the mold, timely detect and warn of abnormal conditions in the extrusion process, and effectively prevent mold damage and product defects.
